The total planned investment is 34.9 billion yuan! Changxin Technology has officially announced the investment and construction of two major new projects.

On September 28, CXMT Technology announced new investments in R&D and capacity expansion projects, according to a report by reporter Guo Hui from the Science and Technology Innovation Board Daily.
In an announcement released on the evening of September 28, CXMT Technology stated that it plans to use over-raised funds of 13 billion yuan to invest in a new technology R&D project. Meanwhile, the company intends to provide 5 billion yuan in over-raised funds to its wholly-owned subsidiary, Changxin Memory Products (Hefei) Co., Ltd. (hereinafter referred to as "CXMT Products Hefei"), through capital increase and loans, for CXMT Products Hefei to invest in the construction of the "Phase II Project of the Memory Wafer Back-end Testing Base of Changxin Memory Products (Hefei) Co., Ltd.".
The total planned investment in the technology R&D project amounts to 24.1 billion yuan, with a construction period of 30 months. The total planned investment in the Phase II project of the back-end testing base is 10.8 billion yuan, which is scheduled to build a testing factory to provide testing and module assembly services for DRAM memory chips.
CXMT Technology stated that the foundation for building and maintaining core competitiveness and long-term development lies in unswervingly promoting the iterative upgrading of products and process technologies. Facing such a complex industrial landscape and technical paths, the company must rely on continuous R&D investment to drive the generational evolution of process technologies, ensuring that new products continuously achieve qualitative leaps in memory density, power consumption control, and read-write performance.
Therefore, the company plans to implement the over-raised fund projects to carry out technology R&D work. While maintaining the company's technological leadership, this will help the company launch products that meet market demands with better performance and stronger competitiveness more quickly, so as to enhance the company's core competitiveness and risk resistance capacity.
Testing is an indispensable and critical link in DRAM production. Due to the characteristics of its dedicated testing equipment, as the company's production capacity continues to increase and product varieties expand, it may face problems such as insufficient testing capacity from external packaging and testing factories and insufficient supporting new investments.
CXMT Technology stated that in order to ensure that testing capacity does not become a bottleneck restricting the company's production capacity and to guarantee supply chain security, the company urgently needs to increase investment in self-built testing capacity. At the same time, through self-building memory wafer back-end testing and module projects, the company can coordinate the utilization of testing capacity more flexibly, reduce the testing cost of its DRAM chips, improve operational efficiency and testing technology, which is conducive to the company further improving the IDM model and enhancing its overall competitiveness.
It is understood that the net amount of funds raised by CXMT Technology through its STAR Market IPO is 66.3 billion yuan. Before listing, the company planned to raise 29.5 billion yuan for projects including the technical upgrading and transformation project of the memory wafer manufacturing mass production line, the DRAM memory technology upgrading project, and the forward-looking technology research and development project for dynamic random-access memory.
CXMT Technology has accelerated technological innovation through skip-generation R&D, achieving mass production from the first-generation process technology platform to the fifth-generation process technology platform, as well as product coverage and generational evolution from DDR4 and LPDDR4X to DDR5, LPDDR5/5X, and LPDDR6.
At present, the core products and process technologies of CXMT Technology have reached the international advanced level.
Among them, the fifth-generation process technology platform of CXMT Technology was officially put into mass production in September this year. It is understood that through quadruple patterning technology, CXMT Technology has shrunk the half-pitch of the active area of the memory array to 11.95 nanometers, which is close to the world's top memory mass production platform process. By reforming the process flow and adopting new materials, the aspect ratio of the storage capacitor reaches 45:1; by developing a high-k metal gate (HKMG) process adapted to the DRAM process, the height of the core functional area of the G5 platform has been successfully reduced to 6762 nanometers.
Breakthroughs have also been made in the R&D and introduction progress of CXMT Technology's LPDDR6.
In August this year, CXMT Technology announced that its self-developed latest-generation low-power memory LPDDR6 had achieved mass production, and the first batch of products would be equipped in the Xiaomi 18 Fold foldable flagship phone. The performance of CXMT's LPDDR6 chip has been comprehensively improved compared with the previous generation LPDDR5X. Through architectural innovation and data transmission optimization technology, the data transmission potential is fully released, with a peak rate of 12800Mbps and a maximum chip capacity of 16GB. This is also the world's first commercial application of LPDDR6 products.
After years of development, CXMT Technology has built a complete core technology system in all business links such as DRAM product design, manufacturing process, packaging and testing, module design and application, formed comprehensive accumulation of independent intellectual property rights, and accumulated rich experience in rapid technological iteration and industrialization.
CXMT Technology stated that through previous in-depth cooperation in the industrial chain, the company has enhanced its supply chain security capability, which will provide sufficient guarantee for the smooth implementation of this over-raised fund project, and provide strong support for the continuous expansion of the company's production capacity and the upgrading of process technologies.
(Reporter Guo Hui, Science and Technology Innovation Board Daily)