With a total investment of 12 billion yuan, the Xian Da Xinguang optoelectronic chip base has been put into operation in Optics Valley.

It is learned from the official WeChat account "China Optics Valley" that on September 28, the wafer fab of Leadcore Optoelectronics Technology (Wuhan) Co., Ltd. (hereinafter referred to as "Leadcore Optoelectronics"), a subsidiary of Leadcore Technology Group, went into operation in the East Lake Comprehensive Bonded Zone.
It is understood that this fab is the manufacturing core of the high-end compound semiconductor materials and chip industrialization base invested and built by Leadcore Technology Group with 12 billion yuan, and it is equipped with a large-size optoelectronic chip platform for two materials: 4/6-inch indium phosphide and 6/8-inch gallium arsenide.
After the line is connected, the base has transitioned from the construction period to the process certification and product introduction stage.
Among them, the indium phosphide production line is oriented to the optical communication backbone, covering optical devices such as lasers, modulators and detectors, and also carries high-speed electrical device processes, so that optical chips and electrical chips can be completed on the same production line. The gallium arsenide production line covers devices such as vertical cavity surface emitting lasers (VCSEL) and radio frequency processes, taking into account both optical communication and radio frequency products.
This month, Leadcore Technology Group, together with its subsidiaries Anhui Leadcore Polar Star Technology Co., Ltd. and Wuhan Optics Valley Quantum Technology Co., Ltd. (referred to as "Wuhan Optics Valley Quantum"), has received a joint development and pre-research order from a leading overseas customer for next-generation single-mode 400G optical interconnection, and the final mass production of 12 joint development projects will be carried out at Leadcore Optoelectronics.
At the same time, the indium phosphide optical chips of Wuhan Optics Valley Quantum have been supplied at 100G and 200G rates, with mass production relying on the Leadcore Optoelectronics wafer fab; this month, Leadcore Technology Group also signed a strategic cooperation agreement with Guangzhou Huizhi Microelectronics Co., Ltd. to jointly develop single-mode 400G and higher-rate electrical chips and satellite communication radio frequency front-end chips.
After the Leadcore Optoelectronics wafer fab went into operation, the R&D batches and engineering batches started immediately, with the 200G optical chip foundry introduction taking the lead, and all projects on the 400G platform simultaneously entering the tape-out and verification stage. The platform will be open to the industrial chain in two ways: wafer foundry and joint development. (Reprinted from SEMI)